DEFECT / CAUSE RELATIONSHIP		Coplanarity	Contamination	Metallurgy	Solder Quality	Solder Volume	Reflow Profile	Placement Accuracy	Land Design	Reflow Cycle Too Long	Excessive Reflow Temp	Excessive Heating Rate	Preheat Temp Low	Solder Paste Oxidation	Screen/Stencil Clogged	Insufficient Solder Paste	Oxidized Solder Paste	Paste Viscosity Too Low	Misaligned Component	Excess Solder Deposition	Component Contamination	Board Contamination	Pad Size Mismatch
		Cause
Open Joint	DEFECT
Tombstoning
Voids
Solder Wicking
Non-Wetting
Incomplete Fillets
Poor Strength
Solder Shorts
Solder Balls
Intermetallics
Appearance
Component Cracking
Bridging
Grainy Solder
Laminate Discoloration
Leaching
Halo Effect
Discolored Joint