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860 Pressure Curing Oven (PCO)

A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
Heaters, heat exchangers and blowers are internal to the pressure vessel.
When the curing process is complete, the Pressure Curing Ovens automatically relieves its pressure to 1atm and cools.

Process Specification:

Process time: Generally 120 min or User’s spec
Operating temp: 60oC ~ 200oC
Maximum temp: 220oC
Operating pressure: 1 bar – 10 bar
Capacity: 24 Magazines (typical)
Cooling method: PCW (17oC – 23oC)
Cooling water pressure: 25 – 40 psi

Pressure Cure Applications:

Composite Forming for the printing industry
Die Attach Curing
Wafer Laminating
Thermal Compress Bonding
Underfill Curing
Via Filling
Film & Tape Bonding

pressure curing oven

System Air Flow

Vacuum Module Option

PCO System Chamber

Chamber Dimensions

PCO System Dimensions

Chamber with shelves extended

Representative Pressure/Temp Profiles (User Configurable)

Representative Pressure/Temp Profiles

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Heller Industries, Inc.

4 Vreeland Road,
Florham Park, NJ 07932, USA

Contact With Us

+1-973-377-6800

+1-973-377-3862

Email

help@hellerindustries.com

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